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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12213286 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Jan. 29, 2020

Heat dissipation member and method of manufacturing the same

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Daisuke Goto, Omuta, JP;

Hiroaki Ota, Omuta, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
H05K 7/20 (2006.01); C04B 35/565 (2006.01); C04B 35/622 (2006.01); C04B 38/02 (2006.01); C04B 41/00 (2006.01); C04B 41/51 (2006.01); C04B 41/52 (2006.01); C04B 41/88 (2006.01); C04B 41/90 (2006.01); C22C 29/06 (2006.01); C22C 32/00 (2006.01); F28F 3/00 (2006.01); F28F 13/18 (2006.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); C04B 35/565 (2013.01); C04B 35/622 (2013.01); C04B 38/02 (2013.01); C04B 41/009 (2013.01); C04B 41/5155 (2013.01); C04B 41/52 (2013.01); C04B 41/88 (2013.01); C04B 41/90 (2013.01); C22C 29/065 (2013.01); C22C 29/067 (2013.01); C22C 32/0063 (2013.01); F28F 3/00 (2013.01); F28F 13/185 (2013.01); F28F 21/02 (2013.01); F28F 21/084 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H05K 7/20481 (2013.01); H05K 7/20845 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/602 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6583 (2013.01); Y10T 428/12007 (2015.01); Y10T 428/12049 (2015.01); Y10T 428/12056 (2015.01); Y10T 428/12063 (2015.01); Y10T 428/12486 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12729 (2015.01); Y10T 428/12736 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/26 (2015.01);
Abstract

A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by fand a flatness of the other main surface different from the one main surface defined by JIS B 0621 is represented by f, fis less than fby 10 μm or more.

Find Patent Forward Citations

Goto, Daisuke. (2025). Heat dissipation member and method of manufacturing the same (U.S. Patent No. 12213286). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12213286

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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