The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Feb. 08, 2021
Applicant:
Nuvoton Technology Corporation Japan, Kyoto, JP;
Inventors:
Katsuya Samonji, Toyama, JP;
Tohru Nishikawa, Toyama, JP;
Assignee:
NUVOTON TECHNOLOGY CORPORATION JAPAN, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0216 (2013.01); H01S 5/0231 (2021.01); H01S 5/0239 (2021.01); H01S 5/02476 (2013.01);
Abstract
Semiconductor light-emitting apparatus includes substrate, submount above substrate, and semiconductor laser above submount. Semiconductor laser and submount are bonded to each other with first bonding material. Substrate and submount are bonded to each other with second bonding material. Submount has first region and second region near substrate, first region being a region on which spacer is disposed, and second region being a region without spacer. Submount is bonded to substrate by covering at least a portion of second region with second bonding material.