logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12212091 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Mar. 04, 2021

Electrical connector apparatus with improved waterproofing and compact size and method of manufacturing thereof

Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takuya Yamashita, Mie, JP;

Tatsuo Hirabayashi, Mie, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

Attorney:

Venjuris, P.C.

Primary Examiner:

Justin M Kratt

Int. Cl.
CPC ...
H01R 13/504 (2006.01); B23K 26/50 (2014.01); B23K 26/57 (2014.01); B29C 65/16 (2006.01); H01R 12/55 (2011.01); H01R 12/72 (2011.01); H01R 13/40 (2006.01); H01R 13/405 (2006.01); H01R 13/52 (2006.01); H01R 43/02 (2006.01); H01R 43/24 (2006.01); B23K 26/00 (2014.01); B23K 26/60 (2014.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29C 65/14 (2006.01); H01R 12/50 (2011.01); H01R 12/51 (2011.01); H01R 12/57 (2011.01); H01R 12/58 (2011.01); H01R 12/71 (2011.01); H01R 13/50 (2006.01); H01R 13/502 (2006.01); H01R 43/00 (2006.01); H01R 43/20 (2006.01);
U.S. Cl.
CPC ...
H01R 13/504 (2013.01); B23K 26/50 (2015.10); B23K 26/57 (2015.10); B29C 65/16 (2013.01); H01R 12/55 (2013.01); H01R 12/724 (2013.01); H01R 13/40 (2013.01); H01R 13/405 (2013.01); H01R 13/52 (2013.01); H01R 13/5213 (2013.01); H01R 13/5216 (2013.01); H01R 43/02 (2013.01); H01R 43/24 (2013.01); B23K 26/00 (2013.01); B23K 26/60 (2015.10); B29C 65/00 (2013.01); B29C 65/02 (2013.01); B29C 65/14 (2013.01); H01R 12/50 (2013.01); H01R 12/51 (2013.01); H01R 12/57 (2013.01); H01R 12/58 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 12/716 (2013.01); H01R 12/727 (2013.01); H01R 13/50 (2013.01); H01R 13/502 (2013.01); H01R 43/00 (2013.01); H01R 43/20 (2013.01);
Abstract

Provided is a connector apparatus including: a circuit board; a connector; and a mold resin portion, wherein the circuit board includes a conductor path, the connector includes a housing with a cylindrical shape and made of a resin, and a terminal projecting outward in an axial direction of the housing from inside the housing, the terminal being configured to connect to the conductor path, the mold resin portion collectively covers the circuit board, the terminal located outside the housing, and a portion of the housing; the housing and the mold resin portion include a welded portion formed by welding together constituent materials of the housing and the mold resin portion, and the welded portion is provided around an entire periphery of the housing and has a difference between a maximum width and a minimum width along a circumferential direction of the housing of 30% or less of the maximum width.

Find Patent Forward Citations

Loading…