The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Dec. 21, 2021
Applicants:

Stephan Karns, Dortmund, DE;

Markus Brockmann, Dortmund, DE;

Daniel Bencak, Dortmund, DE;

Arno Kefenbaum, Dortmund, DE;

Timo Starkmuth, Dortmund, DE;

Herve Bouilly, Dortmund, DE;

Franck Terrien, Dortmund, DE;

Dirk Nowak, Dortmund, DE;

Peter Kleine-rumberg, Dortmund, DE;

Inventors:

Stephan Karns, Dortmund, DE;

Markus Brockmann, Dortmund, DE;

Daniel Bencak, Dortmund, DE;

Arno Kefenbaum, Dortmund, DE;

Timo Starkmuth, Dortmund, DE;

Herve Bouilly, Dortmund, DE;

Franck Terrien, Dortmund, DE;

Dirk Nowak, Dortmund, DE;

Peter Kleine-Rumberg, Dortmund, DE;

Assignee:

WILO SE, Dortmund, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); F04D 1/00 (2006.01); F04D 29/00 (2006.01); F04D 29/62 (2006.01); H01R 12/71 (2011.01); H01R 13/621 (2006.01); H02K 11/00 (2016.01); H05K 1/02 (2006.01); F04D 13/06 (2006.01); H01R 12/70 (2011.01); H01R 13/502 (2006.01); H01R 13/62 (2006.01); H02K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2291 (2013.01); F04D 1/00 (2013.01); F04D 29/007 (2013.01); F04D 29/62 (2013.01); H01R 12/71 (2013.01); H01R 13/621 (2013.01); H01R 13/6215 (2013.01); H02K 11/0094 (2013.01); H05K 1/0215 (2013.01); H05K 1/0298 (2013.01); F04D 13/0686 (2013.01); F05D 2230/51 (2013.01); H01Q 1/22 (2013.01); H01R 12/7076 (2013.01); H01R 13/502 (2013.01); H01R 13/62 (2013.01); H02K 7/14 (2013.01); H02K 2213/03 (2013.01); H05K 1/0213 (2013.01); H05K 1/0296 (2013.01);
Abstract

A plug-in electronic expansion module for pump electronics of a centrifugal pump for expanding the pump electronics with at least one additional function has a housing having a lower face and connecting formations thereon for attachment to a pump housing of the pump electronics. Electronics in the module housing provide the additional function. A base is provided on the lower face, and an electrical interface connected to the pump electronics includes a flat support projecting tongue-like from the base on the lower face of the module housing through an opening in the pump housing and carrying contact-forming electrical traces.


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