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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12212033 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Dec. 26, 2023

Low-loss transmission line structure comprising a dielectric layer stacked with conductive layers having signal strips and ground strips and including air grooves close to the signal strips

Applicant:

Huazhong University of Science and Technology, Hubei, CN;

Inventors:

Xiaojun Bi, Hubei, CN;

Jian Li, Hubei, CN;

Ziang Xu, Hubei, CN;

Zixuan Wei, Hubei, CN;

Assignee:

HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY, Hubei, CN;

Attorney:

JCIPRNET

Primary Examiner:

Benny T Lee

Int. Cl.
CPC ...
H01P 3/00 (2006.01); H01P 3/08 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 3/003 (2013.01); H01P 3/006 (2013.01); H01P 3/082 (2013.01); H01P 3/087 (2013.01); H05K 1/0219 (2013.01); H05K 2201/0707 (2013.01);
Abstract

The disclosure discloses a low-loss transmission line structure, which belongs to the field of radio frequency transmission lines and includes at least two metal layers stacked in a vertical manner. A dielectric layer is filled between the metal layers. The metal layers include a signal transmission strip in a middle portion. Ground strips are provided on both sides of the signal transmission strip. Through holes are evenly distributed on the dielectric layer, and the signal transmission strips on each of the metal layers are connected through the through holes to form a signal transmission line. The ground strips on each metal layer are connected through the through holes.

Find Patent Forward Citations

Bi, Xiaojun. (2025). Low-loss transmission line structure comprising a dielectric layer stacked with conductive layers having signal strips and ground strips and including air grooves close to the signal strips (U.S. Patent No. 12212033). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12212033

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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