The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Apr. 11, 2022
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Srinivasa Reddy Yeduru, Fishkill, NY (US);

Naveen Ganagona, Fishkill, NY (US);

George Chang, Tempe, AZ (US);

Byoungyong Park, Bucheon, KR;

Soonjae Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 21/265 (2006.01); H01L 21/285 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 29/45 (2013.01); H01L 21/26513 (2013.01); H01L 21/28568 (2013.01); H01L 21/304 (2013.01); H01L 21/30604 (2013.01);
Abstract

In some aspects, the techniques described herein relate to a semiconductor device including: a substrate having a first side and a second side, the second side being opposite the first side; active circuitry disposed on the first side of the substrate; a metallic implant disposed in the substrate, the metallic implant being a blanket implant on the second side of the substrate; and a metallic layer disposed on the second side of the substrate, the metallic layer and the second side of the substrate including the metallic implant defining an ohmic contact.


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