The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Jul. 30, 2020
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Zhongyu Luan, Zhejiang, CN;

Zhen Huang, Zhejiang, CN;

Li Liu, Zhejiang, CN;

Kai Chen, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 27/14683 (2013.01); H01L 23/433 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14154 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32237 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92227 (2013.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01);
Abstract

Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.


Find Patent Forward Citations

Loading…