The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Jan. 13, 2022
Applicant:

Playnitride Display Co., Ltd., Zhunan Township, Miaoli County, TW;

Inventors:

Shiang-Ning Yang, Zhunan Township, TW;

Yung-Chi Chu, Zhunan Township, TW;

Yu-Yun Lo, Zhunan Township, TW;

Bo-Wei Wu, Zhunan Township, TW;

Yu-Ya Peng, Zhunan Township, TW;

Assignee:

PLAYNITRIDE DISPLAY CO., LTD., Zhunan Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 24/13 (2013.01); H01L 25/167 (2013.01); H01L 33/38 (2013.01); H01L 24/10 (2013.01); H01L 24/81 (2013.01); H01L 24/98 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/98 (2013.01);
Abstract

A micro LED display panel is provided. The micro LED display panel includes a driving substrate and a plurality of bonding pads disposed on the driving substrate and spaced apart from each other. The micro LED display panel also includes a plurality of micro LED structures electrically connected to the bonding pads. Each micro LED structure includes at least one electrode disposed on the side of the micro LED structure facing the driving substrate. The electrode has a normal contact surface and a side contact surface. The normal contact surface faces the driving substrate, and the side contact surface is laterally connected to the corresponding bonding pad.


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