The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Sep. 21, 2021
Infineon Technologies Austria Ag, Villach, AT;
Balehithlu Manjappaiah Upendra, Singapore, SG;
Kok Kiat Koo, Singapore, SG;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A semiconductor package includes a first semiconductor die, a first group of leads that each comprise an interior end, and an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interior ends of the leads from the first group, wherein a gap is disposed between outer sidewalls of two immediately adjacent ones of the leads from the first group, wherein the first semiconductor die is mounted on the first group of leads such that a lower surface of the first semiconductor die faces and overlaps with each of the leads from the first group, and wherein the lower surface of the first semiconductor die extends across the gap between outer sidewalls of two immediately adjacent ones of the leads from the first group.