The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Aug. 17, 2023
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Christian Kasztelan, Penang, MY;
Nee Wan Khoo, Melaka, MY;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/495 (2013.01);
Abstract
A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure, and covering at least part of the interface structure by a protection cap.