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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12211656 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Aug. 21, 2020

Photovoltaic structure and method of fabrication

Applicant:

Maxeon Solar Pte. Ltd., Singapore, SG;

Inventors:

Lili Wang, Fremont, CA (US);

Nadeem Haque, Fremont, CA (US);

Jeong Chul Lee, Fremont, CA (US);

Assignee:

Maxeon Solar Pte. Ltd., Singapore, SG;

Attorney:

Schmidt Patent Law, Inc.

Primary Examiner:

Andrew J Golden

Int. Cl.
CPC ...
H01G 9/20 (2006.01); H01G 9/00 (2006.01); H01L 31/0296 (2006.01); H01L 31/0304 (2006.01); H01L 31/032 (2006.01); H01L 31/0352 (2006.01); H10K 19/20 (2023.01); H10K 30/30 (2023.01); H10K 30/57 (2023.01); H10K 30/82 (2023.01); H10K 30/88 (2023.01); H10K 77/10 (2023.01); H10K 85/20 (2023.01);
U.S. Cl.
CPC ...
H01G 9/2072 (2013.01); H01G 9/0036 (2013.01); H01G 9/2009 (2013.01); H01G 9/2077 (2013.01); H01G 9/2095 (2013.01); H01L 31/0296 (2013.01); H01L 31/0304 (2013.01); H01L 31/0322 (2013.01); H01L 31/0326 (2013.01); H01L 31/035218 (2013.01); H10K 19/20 (2023.02); H10K 30/30 (2023.02); H10K 30/57 (2023.02); H10K 30/82 (2023.02); H10K 30/88 (2023.02); H10K 77/111 (2023.02); H10K 85/221 (2023.02);
Abstract

A photovoltaic device includes one or more features that taken alone or in combination enhance its efficiency. Some embodiments may comprise a tandem solar device in which a top PV cell is fabricated upon a front transparent substrate, that also serves as the top encapsulating substance. The top PV cell including the front encapsulating substance is then bonded (e.g., using adhesive) to a bottom PV cell in order to complete the tandem device. Using the same transparent, insulating element as both front encapsulating substance and a substrate for fabricating the top PV cell, obviates to the need to provide a separate structure (with resulting interfaces) to perform the latter role. For tandem and non-tandem PV devices, a Through-Substrate-Via (TSV) structure may extend through an insulating substrate in order to provide contact with an opposite side (e.g., back electrode). Embodiments may find particular use in fabricating shingled perovskite photovoltaic solar cells.

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