logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12210285 B1

PDFFull Text
Date of Patent:
Jan. 28, 2025

Filed:

Jul. 25, 2019

Resin composition, resin sheet, cured film, method for producing cured film, semiconductor device, and display device

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Keika Hashimoto, Otsu, JP;

Yuki Masuda, Otsu, JP;

Yuki Takeyama, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08G 73/10 (2006.01); C08G 73/22 (2006.01); C08J 5/18 (2006.01); C08K 5/00 (2006.01); C08K 5/23 (2006.01); C08L 61/34 (2006.01); C08L 79/08 (2006.01); G03F 7/004 (2006.01); G03F 7/022 (2006.01); G03F 7/023 (2006.01); G03F 7/039 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); G09F 9/30 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08G 73/1067 (2013.01); C08J 5/18 (2013.01); C08L 61/34 (2013.01); C08L 79/08 (2013.01); G03F 7/039 (2013.01); H01L 21/4857 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/20 (2013.01); H01L 27/124 (2013.01); H01L 27/1248 (2013.01); C08J 2361/34 (2013.01); C08J 2379/08 (2013.01); C08J 2471/12 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01);
Abstract

Provided is a resin composition which makes it possible to improve the resistance to a flux to be used in soldering and the resistance to reflow, and which, when used as a photosensitive resin composition, can be cured into a film capable of being imparted with such thick film processability that the film can be processed with high sensitivity even when the thickness of the film is as high as 15 μm or more. A resin composition comprising (A) a resin having a structural unit represented by general formula (1) and/or general formula (2), (B) a phenolic resin and (C) an antioxidant agent, wherein the phenolic resin (B) contains a structure represented by general formula (3).

Find Patent Forward Citations

Loading…