The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Nov. 23, 2021
Applicant:

Laird Technologies (Shenzhen) Ltd., Shenzhen, CN;

Inventors:

Yi-Shen Lin, Taiwan, TW;

Min-Wei Hsu, Taiwan, TW;

Tsang-I Tsai, Xinbei, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F16J 15/10 (2006.01); F16J 15/02 (2006.01); F16J 15/12 (2006.01);
U.S. Cl.
CPC ...
F16J 15/102 (2013.01); F16J 15/022 (2013.01); F16J 15/104 (2013.01); F16J 15/128 (2013.01);
Abstract

An electrically and thermally conductive gasket includes a resilient core including a plurality of sides, a heat spreader disposed along at least two sides of the plurality of sides of the resilient core, and an electrically conductive layer disposed along and/or covering at least a portion of the heat spreader, such that the portion of the heat spreader is between the resilient core and the electrically conductive layer. The gasket is positionable and/or compressible between first and second surfaces to thereby define an electrically conductive path and a thermally conductive path between the first and second surfaces.


Find Patent Forward Citations

Lin, Yi-Shen. (2025). Electrically and thermally conductive gaskets (U.S. Patent No. 12209664). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12209664

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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