The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2025
Filed:
Sep. 21, 2021
Applicant:
Kaneka Corporation, Osaka, JP;
Inventor:
Tetsuo Okura, Settsu, JP;
Assignee:
KANEKA CORPORATION, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B29B 11/10 (2006.01); B29B 11/14 (2006.01); B29C 51/00 (2006.01); B29C 51/10 (2006.01); B29C 51/42 (2006.01); B29K 67/00 (2006.01); B29L 31/00 (2006.01); B65D 1/26 (2006.01); B65D 25/04 (2006.01); B65D 43/02 (2006.01); C08L 67/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29B 11/10 (2013.01); B29B 11/14 (2013.01); B29C 51/002 (2013.01); B29C 51/10 (2013.01); B29C 51/421 (2013.01); B65D 1/26 (2013.01); B65D 25/04 (2013.01); B65D 43/02 (2013.01); C08L 67/04 (2013.01); B29K 2067/04 (2013.01); B29L 2031/712 (2013.01); C08J 2367/04 (2013.01); C08J 2467/04 (2013.01); C08L 2201/06 (2013.01); C08L 2203/30 (2013.01); C08L 2205/025 (2013.01);
Abstract
Provided is a resin sheet for thermoforming, the resin sheet containing a poly(3-hydroxybutyrate) resin. A difference between a melting point peak temperature and a melting point peak end temperature in differential scanning calorimetry analysis of the poly(3-hydroxybutyrate) resin is 10° C. or more. The sheet has a thickness of 0.15 to 1 mm. The melt viscosity of the poly(3-hydroxybutyrate) resin at 160° C. is preferably 10000 poise or more.