The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2025

Filed:

Dec. 23, 2020
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Reinhold Bruestle, Frankenburg am Hausruck, AT;

David A. Chartrand, Mesa, AZ (US);

Thomas Rittenschober, Nussdorf am Attersee, AT;

Scott William Easterbrook, Bainbridge Island, WA (US);

Manuel Schoenauer, Thalgau, AT;

Andreas Kremsl, Wolfgang im Salzkammergut, AT;

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4483 (2013.01); A61B 8/4427 (2013.01);
Abstract

Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.


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