The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Aug. 02, 2023
Rigetti & Co, Llc, Berkeley, CA (US);
Jayss Daniel Marshall, Fair Oaks, CA (US);
Chih-Yang Li, Menlo Park, CA (US);
Biswajit Sur, San Jose, CA (US);
Nagesh Vodrahalli, Los Altos, CA (US);
Mehrnoosh Vahidpour, El Cerrito, CA (US);
William Austin O'Brien, IV, Sylmar, CA (US);
Andrew Joseph Bestwick, Berkeley, CA (US);
Chad Tyler Rigetti, Walnut Creek, CA (US);
James Russell Renzas, San Mateo, CA (US);
Rigetti & Co, LLC, Berkeley, CA (US);
Abstract
In a general aspect, an integrated quantum circuit includes a first substrate and a second substrate. The first substrate includes a first surface and a recess formed in the first substrate along the first surface. The recess has a recess surface and is configured to enclose a quantum circuit element. The first substrate includes a first electrically-conductive layer disposed on the first surface and covering at least a portion of the recess surface. The first electrically-conductive layer includes a first superconducting material. The second substrate includes a second surface and a quantum circuit element. The second substrate includes a second electrically-conductive layer on the second surface that includes a second superconducting material. The first substrate is adjacent the second substrate to enclose the quantum circuit device within the recess. The first electrically-conductive layer of the first substrate is electrically-coupled to the second electrically-coupled layer of the second substrate.