The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

May. 10, 2023
Applicant:

Origin Quantum Computing Technology (Hefei) Co., Ltd, Hefei, CN;

Inventors:

Liangliang Ma, Hefei, CN;

Bing You, Hefei, CN;

Nianci Wang, Hefei, CN;

Jie Zheng, Hefei, CN;

Wenshu Liu, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 60/01 (2023.01); H10N 60/12 (2023.01);
U.S. Cl.
CPC ...
H10N 60/0912 (2023.02); H10N 60/12 (2023.02);
Abstract

Disclosed are a fabrication method for a superconducting circuit and a superconducting quantum chip. The fabrication method includes: determining, on a substrate, a first junction region located between a first electrical element and a second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming a Josephson junction in the second junction region; detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range; if yes, separating the Josephson junction through cutting, and moving the Josephson junction to the first junction region; and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element.


Find Patent Forward Citations

Ma, Liangliang. (2025). Fabrication method for superconducting circuit and superconducting quantum chip (U.S. Patent No. 12207568). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12207568

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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