The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Aug. 18, 2020
Applicant:

Heliatek Gmbh, Dresden, DE;

Inventors:

Michael Eritt, Dresden, DE;

Christian Kirchhof, Dresden, DE;

Susanne Mueller, Dresden, DE;

Ingrid Panicke, Dresden, DE;

Christian Wisinger, Dresden, DE;

Assignee:

HELIATEK GMBH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 30/81 (2023.01); H10K 30/88 (2023.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H10K 30/81 (2023.02); H10K 30/88 (2023.02); H10K 77/111 (2023.02);
Abstract

A method for electrically conductively contacting an optoelectronic component having at least one protective layer, including: providing the optoelectronic component having the at least one protective layer with at least one busbar arranged below the at least one protective layer, forming at least one opening by at least one laser beam in the at least one protective layer, wherein at least one busbar arranged below the at least one protective layer is partly exposed, such that the at least one busbar is not damaged, introducing a low-melting solder into the at least one opening of the at least one protective layer, aligning and fixing an electrically conductive element that is flexible on a side of the at least one opening opposite the at least one busbar, and forming an electrically conductive connection element in the at least one opening.


Find Patent Forward Citations

Loading…