The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Oct. 25, 2022
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Hayato Takakura, Osaka, JP;

Naoki Shibata, Osaka, JP;

Ryosuke Sasaoka, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/32 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09209 (2013.01); H05K 2201/10227 (2013.01);
Abstract

Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.


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