The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Jul. 19, 2023
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

John Martinis, Santa Barbara, CA (US);

Bob Benjamin Buckley, Santa Barbara, CA (US);

Xiaojun Trent Huang, Santa Barbara, CA (US);

Assignee:

GOOGLE LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/028 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 3/363 (2013.01); H05K 2201/041 (2013.01); H05K 2201/0939 (2013.01); H05K 2201/09481 (2013.01);
Abstract

An interconnection for flex circuit boards used, for instance, in a quantum computing system are provided. In one example, the interconnection can include a first flex circuit board having a first side and a second side opposite the first side. The interconnection can include a second flex circuit board having a third side and a fourth side opposite the third side. The first flex circuit board and the second flex circuit board are physically coupled together in an overlap joint in which a portion of the second side for the first flex circuit board overlaps a portion of the third side of the flex circuit board. The interconnection can include a signal pad structure positioned in the overlap joint that electrically couples a first via in the first flex circuit board and a second via in the second flex circuit board.


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