The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Dec. 09, 2020
Applicant:
At&s (Chongqing) Company Limited, Chongqing, CN;
Inventor:
Jeesoo Mok, Chongqing, CN;
Assignee:
AT&S (Chongqing) Company Limited, Chongqing, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/021 (2013.01); H05K 1/036 (2013.01); H05K 1/053 (2013.01); H05K 1/111 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 3/0047 (2013.01); H05K 3/0094 (2013.01); H05K 3/4688 (2013.01); H05K 2201/096 (2013.01);
Abstract
A component carrier has a stack including a plurality of electrically insulating layer structures and at least one electrically conductive layer structure, wherein two of the at least two electrically insulating layer structures form a dielectric double layer made of two different materials; a through-hole extending through the double dielectric layer; and an electrically conductive material filling at least a part of the through-hole. A method of manufacturing a component carrier is also disclosed.