The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Mar. 24, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Kai Liu, Phoenix, AZ (US);

Jonghae Kim, San Diego, CA (US);

Jui-Yi Chiu, Taichung, TW;

Nosun Park, San Diego, CA (US);

Je-Hsiung Lan, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 7/10 (2006.01); H01P 7/06 (2006.01); H01P 11/00 (2006.01); H03B 5/12 (2006.01);
U.S. Cl.
CPC ...
H01P 7/10 (2013.01); H01P 7/065 (2013.01); H01P 11/008 (2013.01); H03B 5/1206 (2013.01);
Abstract

In an aspect, an apparatus is disclosed that includes a surface-mounted integrated circuit package housing an active oscillator circuit; an integrated ceramic resonator formed from a ceramic substrate having an upper planar surface receiving the surface-mounted integrated circuit package, the integrated ceramic resonator including a plurality of conductive walls forming a conductive periphery of a ceramic cavity in the ceramic substrate, a conductive rod extending vertically into the ceramic cavity, wherein the conductive rod is isolated from contact with the conductive periphery of the ceramic cavity, a first conductive material extending vertically through the upper planar surface of the ceramic substrate for connecting the conductive periphery of the ceramic cavity to the surface-mounted integrated circuit package housing the active oscillator circuit; and a second conductive material extending through the upper planar surface of the ceramic substrate for connecting the conductive rod to the surface-mounted integrated circuit package.


Find Patent Forward Citations

Loading…