The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Feb. 21, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Chao Liu, Beijing, CN;

Zhongbao Wu, Beijing, CN;

Gongtao Zhang, Beijing, CN;

Haiwei Sun, Beijing, CN;

Xue Dong, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); G06F 1/16 (2006.01); G06F 3/14 (2006.01); G09G 3/3225 (2016.01); G09G 3/36 (2006.01); H01L 27/12 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H10K 77/10 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G06F 1/1647 (2013.01); G06F 3/1423 (2013.01); G06F 3/1446 (2013.01); G09G 3/3225 (2013.01); G09G 3/3648 (2013.01); H01L 27/1218 (2013.01); H01L 27/1259 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H10K 77/111 (2023.02); G09G 2300/026 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.


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