The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Sep. 17, 2020
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Kayla C. Niccum, Maplewood, MN (US);

Ankit Mahajan, Cupertino, CA (US);

Saagar A. Shah, Minneapolis, MN (US);

Kara A. Meyers, Oakdale, MN (US);

Mikhail L. Pekurovsky, Bloomington, MN (US);

Jonathan W. Kemling, Woodbury, MN (US);

David C. Mercord, Prescott, WI (US);

Pranati Mondkar, Minneapolis, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 23/3121 (2013.01); H01L 23/49827 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/92 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/92144 (2013.01);
Abstract

A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.


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