The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Jan. 07, 2022
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventor:

Zhiqiang Xiang, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01);
Abstract

This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.


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