The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Mar. 07, 2022
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Ryohei Okabe, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component module includes a substrate, a mounting-type electronic component, a mounting-type electronic component, an insulating resin, and an insulating resin. The mounting-type electronic component is mounted on a first main surface of the substrate. The mounting-type electronic component is mounted on a second main surface of the substrate. The insulating resin covers the first main surface and the first mounting-type electronic component. The insulating resin covers the second main surface and the second mounting-type electronic component. The first mounting-type electronic component is an electronic component including a semiconductor substrate. A top surface of the semiconductor substrate of the first mounting-type electronic component opposite to the first main surface is exposed from the insulating resin. Printing is applied to the top surface, which is an exposed surface of the semiconductor substrate.