The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Oct. 15, 2018
Applicant:

Iowa State University Research Foundation, Inc., Ames, IA (US);

Inventors:

Jun Cui, Ames, IA (US);

Baozhi Cui, Ames, IA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/153 (2006.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 9/04 (2006.01); H01F 1/055 (2006.01); H01F 1/057 (2006.01); H01F 1/058 (2006.01); H01F 1/059 (2006.01); H01F 41/02 (2006.01); B22F 1/054 (2022.01); B22F 3/14 (2006.01); B22F 3/18 (2006.01); B22F 3/20 (2006.01); B33Y 10/00 (2015.01); C22C 19/07 (2006.01); C22C 38/00 (2006.01); H01F 1/08 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0266 (2013.01); B22F 1/05 (2022.01); B22F 1/052 (2022.01); B22F 9/04 (2013.01); H01F 1/0551 (2013.01); H01F 1/0555 (2013.01); H01F 1/0557 (2013.01); H01F 1/0577 (2013.01); H01F 1/058 (2013.01); H01F 1/059 (2013.01); H01F 1/15325 (2013.01); B22F 1/054 (2022.01); B22F 3/14 (2013.01); B22F 3/18 (2013.01); B22F 3/20 (2013.01); B22F 2009/044 (2013.01); B22F 2301/155 (2013.01); B22F 2301/355 (2013.01); B22F 2304/10 (2013.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12); C22C 19/07 (2013.01); C22C 38/005 (2013.01); C22C 2202/02 (2013.01); H01F 1/086 (2013.01);
Abstract

New types of particle feedstocks and heterogeneous grain structures are provided for rare earth permanent magnets (REPMs) and their production in a manner to significantly enhance toughness of the magnet with little or no sacrifice in the hard magnetic properties. The novel tough REPMs made from the feedstock have heterogeneous grain structures, such as bi-modal, tri-modal, multi-modal, laminated, gridded, gradient fine/coarse grain structures, or other microstructural heterogeneity and configurations, without changing the chemical compositions of magnets.


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