IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12205758 B1

PDFFull Text
Date of Patent:
Jan. 21, 2025

Filed:

Nov. 24, 2020

Coil component

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Sung Sik Shin, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Tuyen T Nguyen

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 19/04 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/32 (2013.01); H01F 19/04 (2013.01); H01F 27/02 (2013.01); H01F 27/24 (2013.01); H01F 27/292 (2013.01); H01F 27/306 (2013.01);
Abstract

A coil component includes a body including a core, a molded portion having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface, and a cover portion disposed on the molded portion, first and second receiving grooves disposed in the first surface of the molded portion to be spaced apart from each other and disposed outside of a region corresponding to the core, in the first surface of the molded portion, a wound coil disposed between the molded portion and the cover portion, and wound around the core, and a first noise removing portion disposed between the wound coil and the second surface of the molded portion.

Find Patent Forward Citations

Loading…