The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Mar. 29, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Kang Wook Bong, Suwon-si, KR;

Jae Youn Park, Suwon-si, KR;

Jin Won Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil component includes a body, a support substrate disposed within the body, a coil disposed on at least one surface of the support substrate, and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the coil. The coil unit includes a first conductive layer disposed on the support substrate, a second conductive layer disposed on the first conductive layer and spaced apart from the support substrate, and a third conductive layer disposed on the second conductive layer to cover at least a portion of a side surface of the second conductive layer and spaced apart from the support substrate to expose a side surface of the first conductive layer.


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