The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Apr. 18, 2022
Applicant:

Sunrise Memory Corporation, San Jose, CA (US);

Inventors:

Shohei Kamisaka, Kanagawa, JP;

Vinod Purayath, Sedona, AZ (US);

Assignee:

SUNRISE MEMORY CORPORATION, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G11C 16/04 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
G11C 16/0483 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02);
Abstract

A process for fabricating a three-dimensional NOR memory string of storage transistors implements a channel-last fabrication process with channel replacement using silicon germanium (SiGe). In particular, the process uses silicon germanium as a sacrificial layer, to be replaced with the channel material after the charge-storage layer of the storage transistors is formed. In this manner, the channel region is prevented from experiencing excessive high-temperature processing steps, such as during the annealing of the charge-storage layer.


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