The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Nov. 23, 2022
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Kyoungtaek Lim, Seoul, KR;

Taekyu Choi, Seoul, KR;

Younghwan Kim, Seoul, KR;

Seonggeun Kim, Seoul, KR;

Changseok Kim, Seoul, KR;

Kyungho Kong, Seoul, KR;

Kyounghwa Kim, Seoul, KR;

Youngrae Lee, Seoul, KR;

Inkwan Yeo, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/487 (2006.01); A61B 5/00 (2006.01); A61B 5/05 (2021.01); A61B 10/00 (2006.01); B01L 3/00 (2006.01); G01N 27/414 (2006.01); G01N 33/543 (2006.01); G06K 7/14 (2006.01); G06Q 20/32 (2012.01); H01R 12/72 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01N 33/48785 (2013.01); A61B 5/0022 (2013.01); A61B 5/05 (2013.01); A61B 5/742 (2013.01); A61B 5/7495 (2013.01); A61B 10/0045 (2013.01); B01L 3/502715 (2013.01); G01N 27/4145 (2013.01); G01N 33/48707 (2013.01); G01N 33/48778 (2013.01); G01N 33/5438 (2013.01); G06K 7/1417 (2013.01); G06K 7/1447 (2013.01); G06Q 20/3223 (2013.01); H01R 12/72 (2013.01); H05K 1/181 (2013.01); B01L 2200/027 (2013.01); B01L 2200/04 (2013.01); B01L 2200/16 (2013.01); B01L 2300/022 (2013.01); B01L 2300/023 (2013.01); B01L 2300/027 (2013.01); B01L 2300/0636 (2013.01); B01L 2300/0645 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/0848 (2013.01); B01L 2300/0861 (2013.01); H01R 2201/12 (2013.01); H01R 2201/20 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10265 (2013.01); H05K 2201/10386 (2013.01);
Abstract

Provided is a probe device for testing a sensor chip that detects a target material from an analysis specimen, has a reactant reacting specifically with the target material, and transmits a generated electrical signal through a pad. The probe device can include a lower housing accommodating a circuit board electrically connectable to an external test device; a middle housing positioned on the lower housing, coupled to the lower housing, and having the sensor chip mounted thereon; a probe module having probe pins for connecting a pad of the sensor chip and a connection pad of the circuit board to each other; and an upper housing positioned on the middle housing, coupled to the middle housing, having a recessed portion that opens the sensor chip, and having a guide area for aligning the probe module on the pads of the sensor chip and the circuit board.


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