The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Sep. 04, 2020
Applicant:

Peking University, Beijing, CN;

Inventors:

Kaihui Liu, Beijing, CN;

Muhong Wu, Beijing, CN;

Dapeng Yu, Beijing, CN;

Enge Wang, Beijing, CN;

Assignee:

PEKING UNIVERSITY, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B21B 3/00 (2006.01); C22F 1/08 (2006.01); C30B 29/02 (2006.01); C30B 29/68 (2006.01); C30B 33/02 (2006.01);
U.S. Cl.
CPC ...
C30B 29/68 (2013.01); B21B 3/00 (2013.01); B32B 15/01 (2013.01); C22F 1/08 (2013.01); C30B 29/02 (2013.01); C30B 33/02 (2013.01); B21B 2003/005 (2013.01);
Abstract

Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.


Find Patent Forward Citations

Liu, Kaihui. (2025). Preparation method for ultrahigh-conductivity multilayer single-crystal laminated copper material, and copper material (U.S. Patent No. 12203193). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12203193

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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