The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

May. 19, 2023
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masanori Tsuruta, Tokyo, JP;

Toru Yumoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); B05D 3/06 (2006.01); B05D 3/14 (2006.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B05D 3/06 (2013.01); B05D 3/145 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); H01Q 1/38 (2013.01);
Abstract

In the present invention, a conductive film having low resistance is formed on a substrate, said film having excellent storage stability and high dispersion stability as an ink. A copper oxide ink () contains a copper oxide (), a dispersant (), and a reducing agent. The content of the reducing agent is in the range of formula (1), and the content of the dispersant is in the range of formula (2). (1) 0.00010≤(reducing agent mass/copper oxide mass)≤0.10 (2) 0.0050≤(dispersant mass/copper oxide mass)≤0.30 The reducing agent content promotes the reduction of copper oxide to copper during firing, and promotes the sintering of copper.


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