The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Jan. 30, 2019
Applicant:

Delo Industrie Klebstoffe Gmbh & Co. Kgaa, Windach, DE;

Inventors:

Markus Ehret, Windach, DE;

Andreas Henschel, Windach, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 18/69 (2006.01); C08G 18/24 (2006.01); C08G 18/48 (2006.01); C08G 18/50 (2006.01); C08G 18/62 (2006.01); C08G 18/79 (2006.01); C08G 18/80 (2006.01); C09D 4/00 (2006.01); C09J 4/00 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
C08G 18/4812 (2013.01); C08G 18/242 (2013.01); C08G 18/5027 (2013.01); C08G 18/6204 (2013.01); C08G 18/69 (2013.01); C08G 18/798 (2013.01); C08G 18/8006 (2013.01); C09D 4/00 (2013.01); C09J 4/00 (2013.01); C09J 5/06 (2013.01); C09J 2475/00 (2013.01);
Abstract

The invention relates to isocyanate-based, storage-stable, one-part compositions that are fixable by irradiation with actinic radiation and curable by heat. The composition comprises (A) an at least bifunctional, solid isocyanate having a passivated surface and a melting point of at least 40° C.; (B) an isocyanate-reactive component selected from the group of alcohols, amines and thiols, and mixtures thereof; (C) a radiation-curable compound; and (D) a photoinitiator. Optionally, further additives (E) can be contained in the composition according to the present invention. The compositions, by fixation with actinic radiation, can be transferred into a state that ensures dimensional stability of the compositions during heat curing.


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