The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Jun. 17, 2020
Applicant:
Northwestern University, Evanston, IL (US);
Inventors:
Mark C. Hersam, Wilmette, IL (US);
Xiaolong Liu, Ithaca, NY (US);
Assignee:
NORTHWESTERN UNIVERSITY, Evanston, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C01B 32/182 (2017.01); B05D 5/12 (2006.01); C01B 35/02 (2006.01); C01B 35/04 (2006.01); C23C 14/04 (2006.01); C23C 14/12 (2006.01); C23C 14/24 (2006.01); C23C 16/04 (2006.01); C23C 16/22 (2006.01); H01B 1/06 (2006.01); H10K 71/16 (2023.01); H10K 77/10 (2023.01); H10K 85/30 (2023.01); H10K 85/60 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
C01B 35/04 (2013.01); B05D 5/12 (2013.01); C23C 14/04 (2013.01); C23C 14/12 (2013.01); C23C 14/24 (2013.01); C23C 16/04 (2013.01); C23C 16/22 (2013.01); H01B 1/06 (2013.01); H10K 71/166 (2023.02); H10K 77/10 (2023.02); H10K 85/322 (2023.02); C01P 2002/20 (2013.01); C01P 2002/60 (2013.01); C01P 2004/90 (2013.01); C01P 2006/40 (2013.01); C01P 2006/90 (2013.01); H10K 85/621 (2023.02); H10K 2102/00 (2023.02);
Abstract
The invention relates to two dimensional (2D) heterostructures and methods of fabricating the same. The 2D hetero structures are integration of borophene with graphene and 2D lateral and vertical hetero structures with sharp and rotationally commensurate interfaces. The rich bonding configurations of boron indicate that borophene can be integrated into a diverse range of 2D heterostructures.