The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Jul. 06, 2021
Applicant:

Morphotonics Holding B.v., Veldhoven, NL;

Inventors:

Maryam Shahrokhvand, Eindhoven, NL;

Bram Johannes Titulaer, Veldhoven, NL;

Jan Matthijs Ter Meulen, Eindhoven, NL;

Assignee:

MORPHOTONICS HOLDING B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41K 1/38 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
B41K 1/38 (2013.01); G03F 7/0002 (2013.01);
Abstract

A flexible stamp includes at least one strengthening layer and texturing layer with a relief area. At least part of the at least one strengthening layer is positioned below the at least one texturing layer and at least partially supports the relief area and texturing layer. The combination of this part of strengthening layer, texturing layer and relief area forms an active area. The flexible stamp includes a non-active area having at least one further part of the at least one strengthening layer which does not support the texturing layer and relief area or at least one further strengthening layer. Each strengthening layer has a thermal expansion coefficient of 10 ppm/° C. or lower, a Young's modulus of 10 GPa-200 GPa, and thickness below 300 μm. The active area and the non-active area of the flexible stamp represent at least 90% of the total area of the flexible stamp.


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