The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2025

Filed:

Oct. 25, 2022
Applicants:

Yuu Sugioka, Kanagawa, JP;

Toshiaki Masuda, Kanagawa, JP;

Kentaroh Yamanaka, Kanagawa, JP;

Hitoshi Usami, Kanagawa, JP;

Inventors:

Yuu Sugioka, Kanagawa, JP;

Toshiaki Masuda, Kanagawa, JP;

Kentaroh Yamanaka, Kanagawa, JP;

Hitoshi Usami, Kanagawa, JP;

Assignee:

RICOH COMPANY, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A head includes: a silicon substrate; an insulating film on the silicon substrate; an electrode wiring on the insulating film; a flexible wiring connected to the electrode wiring; and a conductive film electrically connects the flexible wiring and the electrode wiring in a bonding area. The silicon substrate has an exposed area on a surface of the silicon substrate facing the insulating film, and the exposed area is in a vicinity of the bonding area and is exposed from the insulating film.


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