The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Sep. 17, 2019
Jtekt Corporation, Osaka, JP;
Yusuke Okubo, Kariya, JP;
Masaharu Hasuike, Kariya, JP;
Toshiyuki Baba, Kashihara, JP;
Kouji Kimura, Shiki-gun, JP;
JTEKT Corporation, Osaka, JP;
Abstract
A device for assisting molding condition determination includes a molding state data adjustment amount obtaining unit and a molding condition element adjustment amount obtaining unit. The molding state data adjustment amount obtaining unit obtains, using a first learning model, a molding state data adjustment amount having a value equivalent to a difference between molding state data detected by a sensor and a molding state data target value. The molding condition element adjustment amount obtaining unit obtains, using a second learning model, an adjustment amount for a molding condition element corresponding to the molding state data adjustment amount.