The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Nov. 06, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen W. Bedell, Wappingers Falls, NY (US);

Steven J. Holmes, Ossining, NY (US);

Ning Li, White Plains, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); C23C 14/04 (2006.01); C23C 14/16 (2006.01); C23C 14/28 (2006.01); C23C 14/56 (2006.01); G03F 1/36 (2012.01); H10N 60/01 (2023.01);
U.S. Cl.
CPC ...
H10N 60/0912 (2023.02); C23C 14/042 (2013.01); C23C 14/165 (2013.01); C23C 14/28 (2013.01); C23C 14/56 (2013.01);
Abstract

A deposition system includes a deposition source and a scanning stage disposed within a deposition path of the deposition source. The scanning stage includes a support platform configured to support a wafer thereon, and a mechanical actuator coupled to the support platform. The mechanical actuator is configured to translate the support platform with respect to the deposition source. The deposition system includes a proximity mask disposed within the deposition path of the deposition source between the deposition source and the scanning stage, the proximity mask defining a slit. The deposition system includes a controller in communication with the scanning stage, the controller configured to control the mechanical actuator to translate the wafer with respect to the slit such that an angle of deposition remains substantially constant. In operation, the proximity mask prevents deposition source material having a trajectory that is out of alignment with the slit from contacting the wafer.


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