The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

May. 11, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takafumi Kusuyama, Kyoto, JP;

Yoshitaka Echikawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H10N 30/87 (2023.01);
U.S. Cl.
CPC ...
H10N 30/875 (2023.02); H01L 23/31 (2013.01); H01L 23/5385 (2013.01);
Abstract

A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.


Find Patent Forward Citations

Loading…