The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jul. 28, 2021
Applicant:
Htc Corporation, Taoyuan, TW;
Inventors:
Assignee:
HTC Corporation, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 25/065 (2023.01); H05K 1/02 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20218 (2013.01); H01L 25/0657 (2013.01); H05K 1/0203 (2013.01); H05K 7/20236 (2013.01); H05K 7/2039 (2013.01); H05K 7/205 (2013.01); H01L 23/427 (2013.01); H05K 7/20136 (2013.01); H05K 7/20336 (2013.01);
Abstract
An electronic device includes a circuit board, a package on package structure, a heat-conducting cover, and a heat-conducting fluid. The circuit board has a first surface and a second surface opposite to each other. The package on package structure is disposed on the first surface. The package on package structure has at least one heat generating element. The heat-conducting cover is disposed on the second surface and is in thermal contact with the circuit board. The heat-conducting cover and the second surface form an enclosed space. The heat-conducting fluid is filled in the enclosed space.