The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jul. 08, 2022
Toppan Inc., Tokyo, JP;
Jun Onohara, Tokyo, JP;
TOPPAN INC., Tokyo, JP;
Abstract
A circuit board having excellent reliability of connection between layers while being capable of achieving a compact and low-profile electronic device. In the circuit board has an LC circuit built therein with the use of a glass core having a through hole, a conductor layer formed in the through hole is connected to a wiring pattern formed on one surface of the glass core, and connected to a wiring pattern formed on the other surface of the glass core, with the conduction layer projected from the surface of the glass core. Thus, the area of contact between the conduction layer and the through hole is increased, thus making it possible to prevent the reliability of connection between layers in the through hole from being decreased, even when the glass core is reduced in thickness for achieving a low-profile device.