The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Feb. 02, 2022
Nxp B.v., San Jose, CA (US);
Antonius Hendrikus Jozef Kamphuis, Nijmegen, NL;
Jan Willem Bergman, Veghel, NL;
Marcellinus Johannes Maria Geurts, Beuningen, NL;
Mustafa Acar, Eindhoven, NL;
Paul Mattheijssen, Boxtel, NL;
Rajesh Mandamparambil, Eindhoven, NL;
Andrei-Alexandru Damian, Arnhem, NL;
Amar Ashok Mavinkurve, Malden, NL;
NXP B.V., Eindhoven, NL;
Abstract
A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.