The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Nov. 27, 2020
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Makoto Yamamoto, Kirishima, JP;

Junichi Minagoe, Kirishima, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01S 5/02315 (2021.01); H01S 5/0237 (2021.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02005 (2013.01); H01L 31/0203 (2013.01); H01S 5/02315 (2021.01); H01S 5/0237 (2021.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01);
Abstract

A wiring base includes a base having a first surface, at least one metal layer positioned on the first surface, at least one lead terminal positioned on the metal layer, and a joining member that is positioned on the metal layer and joins the lead terminal to the metal layer. The lead terminal has a first portion to be in contact with the joining member and also has a second portion being continuous with the first portion. In a cross section of the lead terminal orthogonal to a longitudinal direction of the lead terminal, the first portion has two concave surfaces that are formed near the metal layer so as to be disposed opposite to each other across a center in a transverse direction of the lead terminal.


Find Patent Forward Citations

Quick Actions:

Yamamoto, Makoto. (2025). Wiring base, package for storing semiconductor element, and semiconductor device (U.S. Patent No. 12199194). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12199194

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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