The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Aug. 31, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Wenqu Liu, Beijing, CN;

Feng Zhang, Beijing, CN;

Qi Yao, Beijing, CN;

Zhao Cui, Beijing, CN;

Liwen Dong, Beijing, CN;

Zhijun Lv, Beijing, CN;

Dongfei Hou, Beijing, CN;

Detian Meng, Beijing, CN;

Xiaoxin Song, Beijing, CN;

Libo Wang, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G06V 40/13 (2022.01); H10N 39/00 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G06V 40/1306 (2022.01); H10N 39/00 (2023.02); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05679 (2013.01); H01L 2224/0568 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/0132 (2013.01);
Abstract

Provided is a display substrate, which includes a base substrate, a circuit structure layer disposed on the base substrate, multiple ultrasonic sensing elements and multiple micro light-emitting elements. The multiple ultrasonic sensing elements are disposed on a side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer, and the multiple light-emitting elements are disposed on the side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer. An orthographic projection of the multiple ultrasonic sensing elements on the base substrate does not overlap with an orthographic projection of the multiple micro light-emitting elements on the base substrate.


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