The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
May. 30, 2019
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, CN;
Huilong Zhu, Poughkeepsie, NY (US);
Abstract
An interconnection structure for semiconductor devices formed on a substrate may be arranged under the semiconductor devices. The interconnection structure includes at least one via layer and at least one interconnection layer alternately arranged in a direction from the semiconductor device to the substrate, wherein each via layer includes via holes respectively arranged under at least a part of the semiconductor devices, and each interconnection layer includes conductive nodes respectively arranged under at least a part of the semiconductor devices, and in a same interconnection layer, a conductive channel is provided between at least one conductive node and at least another node; and the via holes in each via layer and the conductive nodes in each interconnection layer corresponding to the via holes at least partially overlap with each other in the direction from the semiconductor device to the substrate.