The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Oct. 18, 2021
Applicant:

American Axle & Manufacturing, Inc., Detroit, MI (US);

Inventors:

James P. Downs, South Lyon, MI (US);

Paul J. Valente, Berkley, MI (US);

Chi-Wai David Lau, LaSalle, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H02K 1/16 (2006.01); H02K 1/20 (2006.01); H02K 5/15 (2006.01); H02K 5/20 (2006.01); H02K 5/22 (2006.01); H02K 7/116 (2006.01); H02K 9/19 (2006.01); H02K 9/22 (2006.01); H02K 11/00 (2016.01); H02K 11/27 (2016.01); H02K 11/33 (2016.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H02K 1/16 (2013.01); H02K 1/20 (2013.01); H02K 5/15 (2013.01); H02K 5/203 (2021.01); H02K 5/225 (2013.01); H02K 7/116 (2013.01); H02K 9/19 (2013.01); H02K 9/227 (2021.01); H02K 11/00 (2013.01); H02K 11/27 (2016.01); H02K 11/33 (2016.01); H01L 23/3736 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/13091 (2013.01); H02K 2211/03 (2013.01);
Abstract

An electrical assembly that includes a semiconductor die, a heat sink and a case. The semiconductor die includes a power semiconductor device with a plurality of terminals, and a plurality of electrically conductive leads. Each of the electrically conductive leads is electrically coupled to an associated one of the terminals on the power semiconductor device. The heat sink has a base, a mount, and a plurality of fins. The mount extends from a first side of the base and is coupled to the semiconductor die. The fins are fixedly coupled to the base and extend from a second side of the base that is opposite the first side of the base. The case is formed of a first electrically insulating material. A first one of the leads is integrally and unitarily formed with the mount.


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