The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Mar. 31, 2021
Texas Instruments Incorporated, Dallas, TX (US);
Jaimal Mallory Williamson, McKinney, TX (US);
Rongwei Zhang, Plano, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
In examples, a semiconductor package comprises a substrate including a conductive layer; a conductive pillar coupled to the conductive layer; and a semiconductor die having first and second opposing surfaces. The first surface is coupled to the conductive pillar. The package also includes a die attach film abutting the second surface of the semiconductor die and a metal layer abutting the die attach film and having a metal layer surface facing away from the die attach film. The metal layer surface is exposed to an exterior of the FCCSP. The package includes a mold compound layer covering the substrate.