The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jul. 28, 2022
Applicant:
Broadcom International Pte. Ltd., Singapore, SG;
Inventor:
Thomas Edward Dungan, Fort Collins, CO (US);
Assignee:
Broadcom International Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/18 (2013.01); H01L 25/0652 (2013.01); H05K 2201/10159 (2013.01);
Abstract
Copper-connected glass modules on a glass board are provided. An apparatus includes one or more dies, an interposer formed of a first material, the interposer coupled to the one or more silicon dies, the interposer comprising an interconnection layer formed on one side of the interposer, wherein the interconnection layer includes a plurality of copper interconnects, and a substrate comprising a top layer, glass core, and a bottom layer, wherein the interconnection layer of the interposer and the top layer of the substrate are copper bonded.