The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2025

Filed:

Feb. 26, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Philip Allan Kraus, San Jose, CA (US);

Thai Cheng Chua, Cupertino, CA (US);

Jaeyong Cho, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/00 (2006.01); H01L 21/02 (2006.01); H01L 21/223 (2006.01); H01L 21/3065 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01J 37/00 (2013.01); H01L 21/0262 (2013.01); H01L 21/2236 (2013.01); H01L 21/3065 (2013.01); H01L 21/67069 (2013.01); H01L 21/67109 (2013.01); H01L 21/68742 (2013.01);
Abstract

A method and apparatus for biasing regions of a substrate in a plasma assisted processing chamber are provided. Biasing of the substrate, or regions thereof, increases the potential difference between the substrate and a plasma formed in the processing chamber thereby accelerating ions from the plasma towards the active surfaces of the substrate regions. A plurality of bias electrodes herein are spatially arranged across the substrate support in a pattern that is advantageous for managing uniformity of processing results across the substrate.


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